Sivers Semiconductors, WIN Semiconductors Expand DFB Laser Output

Lasers

Sivers Semiconductors AB has announced a strategic collaboration with WIN Semiconductors to scale high-volume manufacturing of its proprietary high-power distributed feedback (DFB) lasers and laser arrays.

The partnership strengthens Sivers’ ability to meet global demand for photonic components supporting coarse wavelength division multiplexing (CWDM) and dense wavelength division multiplexing (DWDM) applications.

Fiber optic cabling illustrates the backbone of CWDM and DWDM optical communication networks. (Photo courtesy of Silvers Semiconductors)

WIN Semiconductors will serve as an outsourced manufacturing partner, leveraging its advanced compound semiconductor fabrication capabilities to support Sivers’ growth. The partnership combines WIN’s expertise in large-scale, high-quality semiconductor production with Sivers Semiconductors’ leadership in high-performance laser technology.

“This partnership is a crucial step in our strategy to scale our manufacturing capabilities and ensure our customers receive high-quality, high-performance photonic solutions with greater efficiency and reliability,” said Vickram Vathulya, CEO of Sivers Semiconductors. “By partnering with WIN Semiconductors, we are enhancing our production capabilities and accelerating time-to-market for our customers, supporting applications such as next-generation optical interconnects, silicon photonics, and optical I/O for co-packaged optics (CPO).”

The collaboration will also help address the growing demand for laser chips in AI data centers and next-generation optical networks. WIN Semiconductors brings decades of compound semiconductor manufacturing expertise, including state-of-the-art fabrication processes and facilities optimized for high-volume delivery.

By integrating WIN Semiconductors’ manufacturing capabilities with Sivers Semiconductors’ advanced technology, the partnership aims to drive innovation and strengthen the supply chain for CWDM and DWDM applications.

“We’re excited to work alongside the Sivers team to bring their advanced DFB lasers and arrays to high-volume production,” said William Chang, GM of WIN Semiconductors. “This collaboration combines our manufacturing expertise with Sivers’ innovation to drive next-level performance in CWDM and DWDM applications.”

The alliance supports Sivers’ continued expansion into optical communication markets and reinforces its role as a photonics leader delivering customized solutions for demanding environments.

About Sivers Semiconductors
Sivers Semiconductors (STO:SIVE) is a global developer of SatCom, 5G, 6G, Photonics, and Silicon Photonics, developing high-performance chips and modules that enable gigabit wireless and optical networks. The company’s Wireless and Photonics business units serve sectors from telecommunications to aerospace, providing critical components for high-speed data transmission and advanced sensing applications. The company is also a supplier of custom III-V semiconductor photonics devices, enabling next-generation applications in optical communications and sensing markets, and a key strategic supplier to many Fortune-100 and Silicon Valley customers.

With over 20 years of expertise designing and manufacturing III-V photonic devices across diverse material systems, the foundry provides end-to-end in-house capability, from prototype design to qualified high-volume manufacturing.  With a particular focus on InP sources optimised for silicon photonics integration, it also offers custom high power, InP-based DFB lasers and gain chips, as single emitters or arrays, on its InP100 Product Platform. For more information, please click here.

About WIN Semiconductors
WIN Semiconductors is a pure-play compound semiconductor foundry, providing high-volume GaAs and InP wafer fabrication services. With decades of experience in high-frequency, high-power RF and photonic device manufacturing, WIN enables advanced solutions for 5G, optical networking, and emerging high-performance applications across the global communications landscape.  For more information, please click here.

Source/Photo Credit: Sivers Semiconductors


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