Indium Corporation® will showcase its high-reliability gold-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, January 28–30, in San Francisco, California—the industry’s leading global event for lasers, biomedical optics, quantum technologies, and optoelectronics.
Gold-Based Die-Attach Preform Solutions
Indium Corporation will feature several of its AuLTRA® series preforms and materials, designed to enhance the performance and reliability of optoelectronics and RF power applications:
- AuLTRA® Precision Die-Attach Preforms deliver high-accuracy thickness control, edge quality precision, and enhanced cleanliness to meet the stringent requirements of critical die-attach applications. Available in gold-based alloys, they ensure superior performance critical, high-reliability die-attach applications. In addition, a default waffle pack method is available for gold-based alloys.
- AuLTRA® 75, an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA® 75 product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
- AuLTRA® ThInFORMS, 8.89μm (0.00035″)-thick preforms made from 80Au/20Sn, designed to improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS help combat common issues such as shorting and poor thermal transfer.
- AuLTRA® Fine Ribbon (Indalloy® 182), a fine-grade precision ribbon developed for high-volume, fully automated laser diode assembly processes. Within these auto-feed systems, the precision and quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help to minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
- AuLTRA® 3.2, an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle elevated gold-based alloy processing temperatures. Perfect for high-power LED module array assemblies, the paste ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA® 3.2 delivers superb wetting and low voiding.
- AuLTRA® 5.1, a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures requirements of Au-based alloys. Ideal for high-power LED module array assemblies, this formula provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.
Thermal Interface Materials
- Heat-Spring®, a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
About Indium Corporation
Indium Corporation® is a global refiner, smelter, manufacturer, and supplier of advanced materials for the electronics, semiconductor, thin-film, and thermal management industries. The company’s product portfolio includes solders, fluxes, brazes, thermal interface materials, sputtering targets, indium, gallium, germanium, tin-based metals, and NanoFoil®. Founded in 1934, Indium Corporation has global technical support and manufacturing operations in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
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Source/Photo Credit: Indium Corporation
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